Chen, Dao-Long: search on Z-Library

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1

A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation

Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.37 MB

english, 2012

2

Thermal resistance of side by side multi-chip package: Thermal mode analysis

Chen, Dao-Long, Chen, Tei-Chen, Yang, Ping-Feng, Lai, Yi-Shao

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 4.09 MB

english, 2015

3

Nanomechanical properties of Bi2Te3 thin films by nanoindentation

Tasi, Cheng-Hsun, Tseng, Yu-Chin, Jian, Sheng-Rui, Liao, Ying-Yen, Lin, Chih-Ming, Yang, Ping-Feng, Chen, Dao-Long, Chen, Hsueh-Ju, Luo, Chih-Wei, Juang, Jenh-Yih

Journal:

Journal of Alloys and Compounds

Year:

2015

Language:

english

File:

PDF, 1.09 MB

english, 2015

4

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Physical Aging of Epoxy Molding Compound and Its Influences on the Warpage of Reconstituted Wafer

Chiu, Tz-Cheng, Yin, Wei-Jie, Yeh, En-Yu, Yang, Yu-Ting, Chen, Dao-Long, Tseng, Yi-Hsiu

Year:

2018

File:

PDF, 585 KB

2018

5

Effect of temperature gradient on simultaneously experimental determination of thermal expansion coefficients and elastic modulus of thin film materials

Chen, Tei-Chen, Lin, Wen-Jong, Chen, Dao-Long

Journal:

Journal of Applied Physics

Year:

2004

Language:

english

File:

PDF, 326 KB

english, 2004

6

[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models

Chen, Dao-Long, Chiu, Tz-Cheng, Lee, Shu-Hua, Sung, Po-Hsien, Shih, Meng-Kai, Tarng, David, Hung, Chih-Pin

Year:

2017

Language:

english

File:

PDF, 1.11 MB

english, 2017

7

Mechanical Properties of Ba1-xKxCe0.6Zr0.2Y0.2O3-δ Oxides by Nanoindentation

Yang, Ping-Feng, Chen, Dao-Long, Jian, Sheng-Rui, Lee, Sheng-Wei, Tseng, Chung-Jen

Journal:

Procedia Engineering

Year:

2014

Language:

english

File:

PDF, 914 KB

english, 2014

8

On the oscillatority of viscoelastic functions

Chen, Dao-Long, Wong, Ee-Hua, Chen, Tei-Chen

Journal:

International Journal of Solids and Structures

Year:

2016

Language:

english

File:

PDF, 1.80 MB

english, 2016

9

A power and area efficient CMOS clock/data recovery circuit for high-speed serial interfaces

Journal:

IEEE Journal of Solid-State Circuits

Year:

1996

Language:

english

File:

PDF, 982 KB

english, 1996

10

Using DMA to Simultaneously Acquire Young's Relaxation Modulus and Time-dependent Poisson's Ratio of a Viscoelastic Material

Chen, Dao-Long, Chiu, Tz-Cheng, Chen, Tei-Chen, Chung, Ming-Hua, Yang, Ping-Feng, Lai, Yi-Shao

Journal:

Procedia Engineering

Year:

2014

Language:

english

File:

PDF, 313 KB

english, 2014

11

Mechanical properties of Au nanowires under uniaxial tension with high strain-rate by molecular dynamics

Chen, Dao-Long, Chen, Tei-Chen

Journal:

Year:

2005

Language:

english

File:

PDF, 1.07 MB

english, 2005

12

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Simultaneously obtaining the Young's relaxation modulus and shear relaxation modulus of an epoxy molding compound by using DMA

Chen, Dao-Long, Chiu, Tz-Cheng, Chen, Tei-Chen, Yang, Ping-Feng, Hung, Chih-Pin, Fang, Jen-Kuang

Year:

2014

Language:

english

File:

PDF, 201 KB

english, 2014

13

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Lee, Chang-Chi, Hung, Cp, Cheung, Calvin, Yang, Ping-Feng, Kao, Chin-Li, Chen, Dao-Long, Shih, Meng-Kai, Chien, Chien-Lin Chang, Hsiao, Yu-Hsiang, Chen, Li-Chieh, Su, Michael, Alfano, Michael, Siegel,

Year:

2016

Language:

english

File:

PDF, 788 KB

english, 2016

14

New Bending Algorithm for Field-Driven Molecular Dynamics

Dao-Long Chen, Tei-Chen Chen, Yi-Shao Lai

Journal:

Nanoscale Research Letters

Year:

2010

Language:

english

File:

PDF, 471 KB

english, 2010

15

Effect of Hydrogen implantation on polysilicon p-n junctions

Dao-Long Chen, Guzman, A.M., Greve, D.W.

Journal:

IEEE Transactions on Electron Devices

Year:

1986

Language:

english

File:

PDF, 588 KB

english, 1986

16

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - 3D WL MEMS with Various TSV Technologies' Thermo-Mechanical Analysis

Ou, Ying-Te, Cheng, Hung-Hsiang, Chen, Dao-Long, Lee, Hsiao-Yen, Lee, Ying-Chih, Shih, Meng-Kai, Kuo, Chin-Cheng, Yang, Ping-Feng, Wang, Chen-Chao

Year:

2016

Language:

english

File:

PDF, 721 KB

english, 2016

17

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding

Liu, Chan-Yuan, Chien, Jason, Tseng, Yu-Chou, Liao, Kuo-Hsien, Chan, Alex, Chen, Dao-Long, Shih, Meng-Kai, Gerber, Mark

Year:

2019

File:

PDF, 1.47 MB

2019

18

[IEEE 1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers - San Francisco, CA, USA (6-8 Feb. 1997)] 1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers - A 1.25 Gb/s, 460 mW CMOS transceiver for serial data communication

Dao-Long Chen,, Baker, M.O.

Year:

1997

Language:

english

File:

PDF, 1.19 MB

english, 1997

19

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding

Liu, Chan-Yuan, Chien, Jason, Tseng, Yu-Chou, Liao, Kuo-Hsien, Chan, Alex, Chen, Dao-Long, Shih, Meng-Kai, Gerber, Mark

Year:

2019

File:

PDF, 1.47 MB

2019

20

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Physical Aging of Epoxy Molding Compound and Its Influences on the Warpage of Reconstituted Wafer

Chiu, Tz-Cheng, Yin, Wei-Jie, Yeh, En-Yu, Yang, Yu-Ting, Chen, Dao-Long, Tseng, Yi-Hsiu

Year:

2018

Language:

english

File:

PDF, 585 KB

english, 2018

21

Characterization of aluminum/LPCVD polysilicon Schottky barrier diodes

Dao-Long Chen, David W. Greve, Alberto M. Guzman

Journal:

Solid-State Electronics

Year:

1987

Language:

english

File:

PDF, 628 KB

english, 1987

22

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Development of a consistent multiaxial viscoelastic model for package warpage simulation

Chiu, Tz-Cheng, Huang, Dong-Yi, Lee, Bo-Sheng, Chen, Dao-Long, Yang, Ping-Feng, Kao, Chin-Li

Year:

2015

Language:

english

File:

PDF, 769 KB

english, 2015

23

[IEEE 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2020.10.21-2020.10.23)] 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Compression Molding Mechanism and Parameter Evaluation of SiP

Lin, YiXuan, Hu, Ian, Chen, Dao-Long, Tarng, David, Hung, CP

Year:

2020

File:

PDF, 461 KB

2020

24

Interconversions between linear viscoelastic functions with a time-dependent bulk modulus

Chen, Dao-Long, Chiu, Tz-Cheng, Chen, Tei-Chen, Yang, Ping-Feng, Jian, Sheng-Rui

Journal:

Mathematics and Mechanics of Solids

Year:

2017

Language:

english

File:

PDF, 715 KB

english, 2017

25

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package

Chiu, Tz-Cheng, Wu, Ji-Yen, Liu, Wei-Te, Liu, Chang-Wei, Chen, Dao-Long, Shih, MengKai, Tarng, David

Year:

2020

File:

PDF, 560 KB

2020

26

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Material and Structure Design Optimization for Panel-Level Fan-Out Packaging

Chen, Dao-Long, Hu, Ian, Chen, KarenYU, Shih, Meng-Kai, Tarng, David, Huang, Dinos, On, JY

Year:

2019

Language:

english

File:

PDF, 587 KB

english, 2019

27

[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package

Wu, Ji-Yen, Chen, Ting-Wen, Chiu, Tz-Cheng, Chen, Dao-Long, Chen, Tang-Yuan, Shih, Meng-Kai

Year:

2019

File:

PDF, 1.59 MB

2019

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